The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2006

Filed:

Oct. 01, 2002
Applicants:

Andrew Horch, Sunnyvale, CA (US);

Scott Robins, San Jose, CA (US);

Inventors:

Andrew Horch, Sunnyvale, CA (US);

Scott Robins, San Jose, CA (US);

Assignee:

T-Ram, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/74 (2006.01); H01L 29/87 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a thyristor body having at least one region in a substrate. According to an example embodiment of the present invention, a trench is in a substrate and adjacent to a thyristor body region in the substrate. The trench is lined with an insulative material and further includes conductive material that is insulated from the thyristor body region in the substrate by the liner material. A conductive thyristor control port is located in the trench and adapted for capacitively coupling to the thyristor body region in the substrate and to control current in the thyristor body by causing an outflow of minority carriers in the thyristor. With this approach, conductive material can be used to fill a portion of the trench while using the trench portion including the conductive material to electrically isolate a portion of the thyristor body in the substrate. This approach is particularly useful, for example, in high-density applications where insulative trenches having high aspect ratios are desired.


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