The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Dec. 22, 2003
Eiji Kawamoto, Ibaraki, JP;
Masaaki Hayama, Nara, JP;
Masaaki Katsumata, Hirakata, JP;
Hiroki Yabe, Moriguchi, JP;
Eiji Kawamoto, Ibaraki, JP;
Masaaki Hayama, Nara, JP;
Masaaki Katsumata, Hirakata, JP;
Hiroki Yabe, Moriguchi, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.