The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2006

Filed:

Feb. 01, 2002
Applicants:

Eisuke Wadahara, Iyo-gun, JP;

Masato Honma, Matsuyama, JP;

Soichi Ishibashi, Matsuyama, JP;

Yasunori Nagashima, Iyo-gun, JP;

Yuji Kojima, Iyo-gun, JP;

Inventors:

Eisuke Wadahara, Iyo-gun, JP;

Masato Honma, Matsuyama, JP;

Soichi Ishibashi, Matsuyama, JP;

Yasunori Nagashima, Iyo-gun, JP;

Yuji Kojima, Iyo-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 7/02 (2006.01); C08K 7/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to carbon fiber reinforced resin compositions comprising the following essential components (A), (B) and (C), and to molding compounds and molded products made by processing and molding the carbon fiber reinforced resin composition; Component (A): 0.01 to 0.7% by weight of vapor grown carbon fiber and/or nanotubes based on 100% by weight of the carbon fiber reinforced resin composition, of which the average diameter of single fiber ranges from 1 to 45 nm; Component (B): 6 to 40% by weight of carbon fiber based on 100% by weight of the carbon fiber reinforced resin composition, of which the average diameter of single fiber ranges from 1 to 20 μm; and Component (C): resin. The present invention provides carbon fiber reinforced resin composition, molding compounds and molded products therefrom, having good conductivity, mechanical properties and moldability by the above constitution.


Find Patent Forward Citations

Loading…