The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Mar. 03, 2005
Masahiro Iba, Iwakura, JP;
Hajime Sakai, Aichi, JP;
Takahiro Hayashi, Komaki, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A method of producing a wiring board includes a preliminary plating step of forming a solder resist layer such that the main layer of each metal pad of the board is exposed in each corresponding opening and covering the surface of the exposed main layer with a preliminary Sn plated layer. A solder paste application step involves applying a solder paste, containing solder powder comprised of the high temperature Sn solder and thicker than the preliminary Sn plated layer, on the preliminary Sn plated layer. A subsequent solder melting step involves forming the Sn solder covering layer by melting the solder paste layer together with the preliminary Sn plated layer by heating the solder paste layer to a temperature higher than the liquid phase line temperature of the high temperature Sn solder. This wettingly extends the melted layers over the surface of the main layer.