The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 07, 2006

Filed:

Apr. 07, 2004
Applicant:

Tomoyuki Hatakeyama, Hachioji, JP;

Inventor:

Tomoyuki Hatakeyama, Hachioji, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

This conductor apparatus mounts through a bump a semiconductor chip having an electrode pad on a circuit board having a connection pad at a position opposite to the electrode pad. The bump comprises a first protruding electrode provided on the electrode pad, a second protruding electrode provided on the connection pad, and an electroconductive connection member which integrally covers peripheral surfaces of the first and second protruding electrodes and solid-phase-diffusion-connects these protruding electrodes.


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