The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
Aug. 27, 2002
Kiyotaka Matsukawa, Neyagawa, JP;
Kozo Ishihara, Neyagawa, JP;
Tsuneo Kamiyahata, Neyagawa, JP;
Yoshikazu Inada, Neyagawa, JP;
Yasuyuki Agari, Osaka, JP;
Masayuki Shimada, Sakai, JP;
Kiyotaka Matsukawa, Neyagawa, JP;
Kozo Ishihara, Neyagawa, JP;
Tsuneo Kamiyahata, Neyagawa, JP;
Yoshikazu Inada, Neyagawa, JP;
Yasuyuki Agari, Osaka, JP;
Masayuki Shimada, Sakai, JP;
Nippon Kagaku Yakin Co., Ltd., Osaka, JP;
Osaka Municipal Government, Osaka, JP;
Abstract
A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.