The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
Jan. 18, 2002
Christophe Prior, Le Versoud, FR;
Christophe Prior, Le Versoud, FR;
STMicroelectronics SA, Montrouge, FR;
Abstract
Method of fabricating an optical semiconductor package and optical semiconductor package containing an integrated circuit chip having on a front face an optical sensor and electrical connection regions distributed around this sensor, in which a transparent patch () lies in front of the front face of the chip without covering the electrical connection regions of this chip, plates () defining between them a cavity () in which the said chip and the said patch are stacked and which have annular assembly faces (), electrical connection pads () are placed between the said electrical connection regions and one face () of the said cavity, electrical connection tracks () are carried by a plate () and lie on the said face () of the cavity in order to be in contact with the said pads, an adhesive layer () flying between the said assembly faces (), the said tracks () protruding in order to pass between the assembly faces of the said plates with a view to external connections and the plate located at the side of the said patch comprising an aperture located opposite the optical sensor.