The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
Jan. 09, 2004
Kyoichi Kinoshita, Kariya, JP;
Takashi Yoshida, Kariya, JP;
Tomohei Sugiyama, Kariya, JP;
Hidehiro Kudo, Kariya, JP;
Eiji Kono, Kariya, JP;
Katsufumi Tanaka, Kariya, JP;
Kyoichi Kinoshita, Kariya, JP;
Takashi Yoshida, Kariya, JP;
Tomohei Sugiyama, Kariya, JP;
Hidehiro Kudo, Kariya, JP;
Eiji Kono, Kariya, JP;
Katsufumi Tanaka, Kariya, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya, JP;
Abstract
A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10/° C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m·K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.