The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2006
Filed:
Aug. 27, 2003
Toshiaki Takenaka, Kyoto, JP;
Toshihiro Nishii, Hirakata, JP;
Shigeru Yamane, Hirakata, JP;
Shinji Nakamura, Katano, JP;
Hideaki Komoda, Hirakata, JP;
Kunio Kishimoto, Katano, JP;
Toshiaki Takenaka, Kyoto, JP;
Toshihiro Nishii, Hirakata, JP;
Shigeru Yamane, Hirakata, JP;
Shinji Nakamura, Katano, JP;
Hideaki Komoda, Hirakata, JP;
Kunio Kishimoto, Katano, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes in a incompressible substrate having films on either side thereof via a bonding layer; filling conductive paste into the through-holes; removing the films from the substrate; laminating metallic foils to either side of the substrate and heating same under pressures to harden the bonding layer, bonding the metallic foils to the substrate and electrically connecting the sides of the substrate to each other; and forming a circuit pattern by machining the metallic foils.