The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Jan. 21, 2004
Hisashi Kaneko, Kawasaki, JP;
Hiroyuki Iwahara, Kawasaki, JP;
Yukihiro Komura, Kawasaki, JP;
Mitsuhiro Izumi, Kawasaki, JP;
Shinji Fujimoto, Kawasaki, JP;
Hisashi Kaneko, Kawasaki, JP;
Hiroyuki Iwahara, Kawasaki, JP;
Yukihiro Komura, Kawasaki, JP;
Mitsuhiro Izumi, Kawasaki, JP;
Shinji Fujimoto, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A thermal component is mounted on the front surface of an isolator sheet within a first specific area. A thermally-conductive material is located on the back surface of the isolator sheet on the back of the first specific area. An electrically-conductive material is located on the front surface of the isolator sheet within a second specific area. A thermally-insulating material is located on the back surface of the isolator sheet on the back of the second specific area. The flexible printed circuit board unit of this type allows heat of the thermal component to efficiently radiate from the thermally-conductive material. An increase in temperature can be suppressed in the thermal component. Heat can reliably stay in the electrically-conductive material when a solder material is applied to the surface of the electrically-conductive material. The solder material is allowed to reliably fuse.