The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Jun. 15, 2001
Kazushige Tohta, Tokyo, JP;
Hiroshi Shindo, Tokyo, JP;
Akio Ogawa, Tokyo, JP;
Osamu Fukuroi, Tokyo, JP;
Takashi Fujii, Tokyo, JP;
Kazushige Tohta, Tokyo, JP;
Hiroshi Shindo, Tokyo, JP;
Akio Ogawa, Tokyo, JP;
Osamu Fukuroi, Tokyo, JP;
Takashi Fujii, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The present invention relates to a lapping apparatus and a lapping method that may effect further machining in response to each element on a ceramic bar to the ceramic bar that is largely locally lapped and may reduce a cost needed for machining without any jig for holding the ceramic bar. The ceramic bar is held by a surface of an elastic member made of rubber or the like. A plurality of actuators are arranged on a back surface of this elastic member. When the ceramic bar is depressed against the lapping surface, a specific portion of the ceramic bar is deformed or strongly deformed through the elastic member by these actuators to thereby make it possible to perform the lapping in response to each element.