The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Oct. 02, 2002
Jeffrey A. Underwood, Sunrise, FL (US);
John K. Arledge, Ft. Lauderdale, FL (US);
Thomas J. Swirbel, Davie, FL (US);
Joaquin Barreto, Coral Springs, FL (US);
Jeffrey A. Underwood, Sunrise, FL (US);
John K. Arledge, Ft. Lauderdale, FL (US);
Thomas J. Swirbel, Davie, FL (US);
Joaquin Barreto, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
Methods for forming a metal shield on a printed circuit board () include depositing a first layer of metal () on a substrate () of the printed circuit board (), depositing a first layer of dielectric material () on the first layer of metal (), printing one or more circuits () on the first dielectric layer (), depositing a second layer of dielectric material () over the one or more printed circuits (), forming a trench-like opening () in the two layers of dielectric material () surrounding the one or more printed circuits () so that the metal of the first layer () is exposed by the trench-like opening (), depositing a second layer of metal () on the second layer of dielectric material () such that the second layer of metal () plates the trench-like opening () and makes electrical contact with the first metal layer ().