The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 2006

Filed:

Oct. 30, 2003
Applicants:

Charles L. Byers, Canyon Country, CA (US);

Guangqiang Jiang, Castaic, CA (US);

Gary D. Schnittgrund, Granada Hills, CA (US);

Inventors:

Charles L. Byers, Canyon Country, CA (US);

Guangqiang Jiang, Castaic, CA (US);

Gary D. Schnittgrund, Granada Hills, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 15/16 (2006.01); B23K 1/00 (2006.01); B23K 103/08 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention is a method of bonding a ceramic part to a metal part by heating a component assembly comprised of the metal part, the ceramic part, and a compatible interlayer material such as titanium-nickel alloy placed between the two parts and heated at a temperature that is greater than the eutectic temperature of the interlayer material, where alloys, intermetallics or solid solution formed between the metal part and the metal interlayer material, but that is less than the melting point of either the ceramic part or the metal part. The component assembly is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a hermetic and strong bond between the ceramic part and the metal part. The bonded component assembly is optionally treated with acid to remove unwanted materials, to assure a biocompatible component assembly for implantation in living tissue.


Find Patent Forward Citations

Loading…