The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Oct. 08, 2003
James P. Deyoung, Durham, NC (US);
James B. Mcclain, Raleigh, NC (US);
Stephen M. Gross, Chapel Hill, NC (US);
Doug Taylor, Franklinton, NC (US);
Mark I. Wagner, Raleigh, NC (US);
David Brainard, Wake Forest, NC (US);
James P. DeYoung, Durham, NC (US);
James B. McClain, Raleigh, NC (US);
Stephen M. Gross, Chapel Hill, NC (US);
Doug Taylor, Franklinton, NC (US);
Mark I. Wagner, Raleigh, NC (US);
David Brainard, Wake Forest, NC (US);
Micell Technologies, Inc., Raleigh, NC (US);
Abstract
A method of coating a substrate comprises the steps of: (a) providing a substrate in an enclosed vessel, the substrate having a surface portion; (b) at least partially filling the enclosed vessel with a first supercritical fluid so that said first supercritical fluid contacts the surface portion, with the first supercritical fluid carrying or containing a coating component; then (c) adding a separate compressed gas atmosphere to the reaction vessel so that a boundary is formed between the first supercritical fluid and the separate compressed gas atmosphere, said separate compressed gas atmosphere having a density less than said first supercritical fluid; and then (d) displacing said first supercritical fluid from said vessel by continuing adding said separate compressed gas atmosphere to said vessel so that said boundary moves across said surface portion and a thin film of coating component is deposited on said microelectronic substrate.