The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
Sep. 05, 2002
Lawrence Appalucci, Villanova, PA (US);
Andre Cote, Williamstown, NJ (US);
David Lopez Perez, Ponce, PR (US);
Gary Thomas Mazoki, Sewell, NJ (US);
Anthony Frank Piccoli, Audubon, NJ (US);
Rolando Roques Martinez, Ponce, PR (US);
Luis Francisco Soler Bonnin, Guanica, PR (US);
Takeshi Matsumoto, Kohza-gun, JP;
Hideaki Imaichi, Fujisawa, JP;
Lawrence Appalucci, Villanova, PA (US);
Andre Cote, Williamstown, NJ (US);
David Lopez Perez, Ponce, PR (US);
Gary Thomas Mazoki, Sewell, NJ (US);
Anthony Frank Piccoli, Audubon, NJ (US);
Rolando Roques Martinez, Ponce, PR (US);
Luis Francisco Soler Bonnin, Guanica, PR (US);
Takeshi Matsumoto, Kohza-gun, JP;
Hideaki Imaichi, Fujisawa, JP;
Checkpoint Systems, Inc., Thorofare, NJ (US);
Abstract
A tag and method of making it. The tag includes a first adhesive layer provided in a first predetermined pattern between a surface of a first substrate and a first conductive foil. The first pattern corresponds to a pattern for a first conductive trace, e.g., a portion of a resonant circuit. The first conductive foil is laminated, e.g., adhesively secured, to the surface of the first substrate to form a first conductive layer. A first portion of that layer is shaped, e.g., die-cut, to generally correspond to the first pattern. A second portion of the first conductive layer not corresponding to the first portion is removed, to establish the first conductive trace, with the adhesive layer confined within the boundaries of the first conductive trace. Another conductive trace is secured to the first conductive trace, with a dielectric therebetween, to form a resonant circuit.