The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 24, 2006
Filed:
May. 16, 2003
Thomas W. Kenny, San Carlos, CA (US);
Mark Munch, Los Altos, CA (US);
Peng Zhou, Albany, CA (US);
James Gill Shook, Santa Cruz, CA (US);
Girish Upadhya, San Jose, CA (US);
Kenneth Goodson, Belmont, CA (US);
David Corbin, Los Altos, CA (US);
Thomas W. Kenny, San Carlos, CA (US);
Mark Munch, Los Altos, CA (US);
Peng Zhou, Albany, CA (US);
James Gill Shook, Santa Cruz, CA (US);
Girish Upadhya, San Jose, CA (US);
Kenneth Goodson, Belmont, CA (US);
David Corbin, Los Altos, CA (US);
Cooligy, Inc., Mountain View, CA (US);
Abstract
A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.