The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2006
Filed:
Dec. 21, 2000
Junichi Asada, Yokkaichi, JP;
Junichi Asada, Yokkaichi, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
Disclosed is a semiconductor device constructed such that a lead wire extending from an interposer is connected to a pad of a chip, wherein the chip is bonded to a resin molding with a high mechanical strength. In the semiconductor device of the present invention, the lead wires extending from the interposer formed of a polyimide film are connected to the pad of the chip, and the lead wires are arranged sparse. Dummy lead wires irrelevant to the electrical connection are also arranged in addition to the lead wires extending from the interposer so as to increase the total number of lead wires supporting the chip so as to permit the chipto be bonded to the resin moldingwith a high mechanical strength. The dummy lead wires mounted to the interposer together with the lead wires serve to improve the bonding strength between the resin molding and the chip.