The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2006
Filed:
Jul. 17, 2003
Ayub M Fathimulla, Ellicott City, MD (US);
Olaleye A. Aina, Columbia, MD (US);
Harry Stephen Hier, Sykesville, MD (US);
Ayub M Fathimulla, Ellicott City, MD (US);
Olaleye A. Aina, Columbia, MD (US);
Harry Stephen Hier, Sykesville, MD (US);
Epitaxial Technologies, Baltimore, MD (US);
Abstract
This invention describes an approach for monolithically integrating all the components of a photoreceiver—optical amplifier, optical band-pass filter, and photodiode module—on a single chip. The photoreceiver array employs unique optical amplifier and conversion technologies that provides the ultra-sensitivity required for free space optical communications networks. As an example, by monolithically integrating a vertical cavity surface emitting laser-diode (VCSEL) optical preamplifier with a photodiode receiver and related amplifiers and filters on the same chip, sensitivities as low as −47 dBm (62 photons/bit at 2.5 Gb/s), along with an order of magnitude reduction in size, weight, and power consumption over comparable commercial-off-the-shelf (COTS) components can be demonstrated. In accordance with another aspect of the present invention, the concept of monolithic integration of optical amplifier with photodetector is extended to lasers, another amplifier and modulators covering ultra violet to very long wavelength infrared using the InP, GaAs, GaSb, InAs, InSb, SiGe, SiC and GaN etc based technologies.