The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2006

Filed:

May. 15, 2001
Applicant:

Johann W. Herlyn, Braunschweig, DE;

Inventor:

Johann W. Herlyn, Braunschweig, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method for the manufacture of chipboard comprising a centre layer () of coarse chips and outer layers () of chips whose fibers are oriented in the plane of the board. In order to be able to reduce the density of the finished board while retaining the intrinsic characteristic profile of the board, it is proposed in accordance with the invention that the chips used to compose the centre layer () will comprise end-grain cut, flake-like chips () whose fibers are oriented in the thickness direction () of the chips, the chip fibers in the centre layer being oriented substantially transversely to the plane of the chipboard. The invention also relates to chipboard manufactured in accordance with the method.


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