The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2006

Filed:

Apr. 22, 2004
Applicants:

Takahiro Sajima, Kobe, JP;

Hideaki Kawamatsu, Kobe, JP;

Seiichiro Endo, Kobe, JP;

Inventors:

Takahiro Sajima, Kobe, JP;

Hideaki Kawamatsu, Kobe, JP;

Seiichiro Endo, Kobe, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A63B 37/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Dimplehas a side wall curved faceand an edge neighboring curved face. The side wall curved faceis situated between a point Ppositioned downward from the dimple edge Ed by the depth of 20% in an in-depth direction and a point Ppositioned downward from the dimple edge Ed by the depth of 50% in an in-depth direction. The edge neighboring curved faceis situated between the dimple edge Ed and a point Ppositioned downward from the dimple edge Ed by the depth of 10% in an in-depth direction. Proportion of the number NL of dimpleshaving the diameter of equal to or greater than 3.90 mm occupied in total number N of the dimples is equal to or greater than 75%. Proportion of the number ML of dimples having the ratio (Re/Rw) between a radius of curvature of Re of the edge neighboring curved faceand a radius of curvature Rw of the side wall curved faceof 0.5 or greater and 1.5 or less of equal to or greater than 75%, having the diameter of equal to or greater than 3.90 mm and having the radius of curvature Re of 2.0 mm or greater and 5.0 mm or less, occupied in the number NL is equal to or greater than 50%.


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