The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2006

Filed:

May. 08, 2001
Applicants:

Andreas Norbert Wiswesser, Freiberg, DE;

Walter Schoenleber, Holzgerlingen, DE;

Boguslaw Swedek, San Jose, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Inventors:

Andreas Norbert Wiswesser, Freiberg, DE;

Walter Schoenleber, Holzgerlingen, DE;

Boguslaw Swedek, San Jose, CA (US);

Manoocher Birang, Los Gatos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, and a polishing head to hold a substrate against the polishing pad during processing. The substrate includes a thin film structure disposed on a wafer. A first optical system includes a first light source to generate a first light beam which impinges on a surface of the substrate, and a first sensor to measure light reflected from the surface of the substrate to generate a measured first interference signal. A second optical system includes a second light source to generate a second light beam which impinges on a surface of the substrate and a second sensor to measure light reflected from the surface of the substrate to generate a measured second interference signal. The second light beam has a wavelength different from the first light beam.


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