The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 17, 2006

Filed:

Jul. 30, 2002
Applicants:

Guy R. Wagner, Loveland, CO (US);

Chandrakant D. Patel, Fremont, CA (US);

Inventors:

Guy R. Wagner, Loveland, CO (US);

Chandrakant D. Patel, Fremont, CA (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/00 (2006.01); F28D 15/02 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cooling device primarily for cooling, e.g., integrated circuits or other electronic devices during operation may include a heat sink portion having a plurality of cooling vanes and a heat pipe chamber. Both the cooling vanes and the heat pipe chamber may be integrally formed within the heat sink portion. Because the heat pipe chamber is integrally formed with the cooling vanes, no joints exist between the condensing surface of the heat pipe chamber and the cooling vanes. This, in turn, allows extremely rapid and efficient heat transfer between the heat pipe chamber and the cooling vanes. The cooling device may include extensions of the main heat pipe chamber which project into each of the cooling vanes. In this manner, the condensing surface of the heat pipe chamber is actually moved into the vanes at a position very close to the surface of the vanes where heat transfer into the atmosphere occurs.


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