The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Nov. 27, 2001
Randolph B. Heineke, Rochester, MN (US);
David John Orser, Farmington, MN (US);
Randolph B. Heineke, Rochester, MN (US);
David John Orser, Farmington, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A fiber optic transceiver array and a fiber optic transceiver channel are provided for short wave fiber optic communications. A fiber optic transceiver array for short wave fiber optic communications includes a series of fiber optic transceiver channels. Each fiber optic transceiver channel includes a plurality of test pads. A power distribution bypass capacitor is distributed along the series of fiber optic transceiver channels. A plurality of high voltage power supply and ground connections are coupled through the power distribution bypass capacitor and distributed around the series of fiber optic transceiver channels. A threaded high voltage power supply connection is provided to alternating ones of the series of fiber optic transceiver channels. A threaded ground connection is provided to alternating other ones of the series of fiber optic transceiver channels to reduce power noise generation and susceptibility to noise between adjacent channels. A power to ground decoupling capacitor included with each fiber optic transceiver channel also enhances power noise sensitivity reduction. A fiber optic transceiver channel for short wave fiber optic communications includes at least a high voltage power supply connection and a ground connection. A plurality of test pads includes at least a ground connection and a pair of differential output connections. A channel decoupling capacitor is positioned proximate to the pair of differential output connections.