The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Sep. 05, 2001
Applicants:
Hiroyuki Mori, Shiga-ken, JP;
Yutaka Tsukada, Shiga-ken, JP;
Kimihiro Yamanaka, Shiga-ken, JP;
Inventors:
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed circuit board on which a semiconductor chip is flip chip mounted, comprising a circuit pattern to which a conductive bump, provided in a corner portion of a semiconductor chip, is connected, an insulating layer for holding the circuit pattern, and a protection pad which is positioned on the insulating layer relative to the circuit pattern, to which the conductive bump is connected.