The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2006

Filed:

Dec. 13, 2001
Applicants:

Thomas Patrick Smyth, Palm Bay, FL (US);

Michelle Kay Nelson, Palm Bay, FL (US);

Sarah K. Mobley, Palm Bay, FL (US);

Charles Michael Newton, Palm Bay, FL (US);

Inventors:

Thomas Patrick Smyth, Palm Bay, FL (US);

Michelle Kay Nelson, Palm Bay, FL (US);

Sarah K. Mobley, Palm Bay, FL (US);

Charles Michael Newton, Palm Bay, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/20 (2006.01); H01G 4/30 (2006.01); H01G 4/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for making an electronic module includes forming a low temperature co-fired ceramic (LTCC) substrate with at least one capacitive structure embedded therein. Forming the LTCC substrate may include arranging first and second unsintered ceramic layers and the at least one capacitive structure therebetween. The at least one capacitive structure may include a pair of electrode layers, an inner dielectric layer between the pair of electrode layers, and at least one outer dielectric layer adjacent at least one of the electrode layers and opposite the inner dielectric layer. The at least one outer dielectric layer preferably has a dielectric constant less than a dielectric constant of the inner dielectric layer. The unsintered ceramic layers and the at least one capacitive structure may also be heated, and at least one electronic device may be mounted on the LTCC substrate and electrically connected to the at least one embedded capacitive structure.


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