The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Oct. 13, 2004
Tatsumi Tsuchiya, Kanagawa-ken, JP;
Yuhsuke Matsumoto, Fujisawa, JP;
Takaaki Murokawa, Fujisawa, JP;
Naoki Fujii, Fujisawa, JP;
Takuya Satoh, Kanagawa-ken, JP;
Yasuhiro Mita, Kanagawa-ken, JP;
Hiroyasu Tsuchida, Fujisawa, JP;
Yoshio Uematsu, Kanagawa-ken, JP;
Tatsumi Tsuchiya, Kanagawa-ken, JP;
Yuhsuke Matsumoto, Fujisawa, JP;
Takaaki Murokawa, Fujisawa, JP;
Naoki Fujii, Fujisawa, JP;
Takuya Satoh, Kanagawa-ken, JP;
Yasuhiro Mita, Kanagawa-ken, JP;
Hiroyasu Tsuchida, Fujisawa, JP;
Yoshio Uematsu, Kanagawa-ken, JP;
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
An integrated lead suspension includes a solder ball that is placed between a lead wiring pad provided on a flexure of the suspension, and a bonding pad provided on a slider of a head gimbal section. The lead wiring pad and bonding pad are soldered by melting the solder ball. As a result, there is provided a recessed section into which a solder ball is placed by way of surface raised sections, using gravitational force, in the vicinity of the center line of the surface of the lead wiring pad. In this way the position of the solder ball is not displaced from the center line when a bonding pad and lead wiring pad are connected by means of a solder ball.