The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6984714 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 10, 2006

Filed:

Apr. 23, 2003
Applicants:

Kiwamu Tokuhisa, Chiba, JP;

Hongyuan Wang, Chiba, JP;

Inventors:

Kiwamu Tokuhisa, Chiba, JP;

Hongyuan Wang, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/26 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.


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Tokuhisa, Kiwamu. (2006). Siloxane-modified polyimide resin (U.S. Patent No. 6984714). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6984714

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