The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 2006

Filed:

Dec. 12, 2002
Applicants:

Akiko Sugimoto, Ageo, JP;

Junshi Yoshioka, Ageo, JP;

Makoto Dobashi, Ageo, JP;

Inventors:

Akiko Sugimoto, Ageo, JP;

Junshi Yoshioka, Ageo, JP;

Makoto Dobashi, Ageo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object is the provision of a peelable electrodeposited copper foil with carrier foil that stabilizes the peel strength between the carrier foil and the electrodeposited copper foil layer even when used in manufacture of the printed wiring boards that requires pressing at the temperatures of 200° C. or higher. For the purpose of achieving the object, the electrodeposited copper foil with carrier foil, which includes an adhesive interface layerarranged on one face of the carrier foiland an electrodeposited copper foil layerarranged on the adhesive interface layer, characterized in that the adhesive interface layeris composed of a metal oxide layer ML and an organic material layer OL, and the like are used.


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