The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Mar. 14, 2003
Senichi Hayashi, Tokyo, JP;
Senichi Hayashi, Tokyo, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
The object of this invention is to decrease a stress to accumulate in a resin layer while preventing any uncured portion from forming in a side surface of the resin layer. In order to achieve this object, this invention provides a composite element manufacturing method of forming, on a surface of a base material, a resin layer to which the shape of a molding surface of a mold is transferred, thus manufacturing a composite element in which the base material and the resin layer are integrated. The resin layer is released from the mold when the resin layer is in a cured state where a viscosity Log η of a resin that forms the resin layer is 10 to 15 [dPa·s].
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile