The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Jan. 08, 2003
Barry A. Bonitz, Endwell, NY (US);
Eric Duchesne, Granby, CA;
Michael A. Gaynes, Vestal, NY (US);
Eric A. Johnson, Greene, NY (US);
Barry A. Bonitz, Endwell, NY (US);
Eric Duchesne, Granby, CA;
Michael A. Gaynes, Vestal, NY (US);
Eric A. Johnson, Greene, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.