The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2006
Filed:
Jul. 31, 2003
Jay Alan Morrison, Orlando, FL (US);
Gary Brian Merrill, Orlando, FL (US);
Thomas Barrett Jackson, San Diego, CA (US);
Jay Alan Morrison, Orlando, FL (US);
Gary Brian Merrill, Orlando, FL (US);
Thomas Barrett Jackson, San Diego, CA (US);
Siemens Westinghouse Power Corporation, Orlando, FL (US);
Abstract
A composite structure () having a bond enhancement member () extending across a bond joint () between a ceramic matrix composite (CMC) material () and a ceramic insulation material (), and a method of fabricating such a structure. The bond enhancement member may extend completely through the CMC material to be partially embedded in a core material () bonded to the CMC material on an opposed side from the insulation material. A mold () formed of a fugitive material having particles () of a bond enhancement material may be used to form the CMC material. A two-piece mold () may be used to drive a bond enhancement member partially into the CMC material. A compressible material () containing the bond enhancement member may be compressed between a hard tool () and the CMC material to drive a bond enhancement member partially into the CMC material. A surface () of a ceramic insulation material () having a bond enhancement member () extending therefrom may be used as a mold for laying up a CMC material.