The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6984254 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 10, 2006

Filed:

Jan. 07, 2003
Applicants:

Masakazu Takesue, Kawasaki, JP;

Yasuo Moriya, Kawasaki, JP;

Yoshinori Nemoto, Kawasaki, JP;

Yumiko Fukushima, Kawasaki, JP;

Inventors:

Masakazu Takesue, Kawasaki, JP;

Yasuo Moriya, Kawasaki, JP;

Yoshinori Nemoto, Kawasaki, JP;

Yumiko Fukushima, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20–60 μm. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.


Find Patent Forward Citations

Takesue, Masakazu. (2006). Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy (U.S. Patent No. 6984254). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6984254

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