The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
May. 30, 2003
Robert J. Mclaughlin, Phoenix, AZ (US);
Alexander J. Elliott, Tempe, AZ (US);
Mall Mahalingam, Scottsdale, AZ (US);
Scott D. Marshall, Chandler, AZ (US);
Pierre-marie J. Piel, Tempe, AZ (US);
Robert J. McLaughlin, Phoenix, AZ (US);
Alexander J. Elliott, Tempe, AZ (US);
Mall Mahalingam, Scottsdale, AZ (US);
Scott D. Marshall, Chandler, AZ (US);
Pierre-Marie J. Piel, Tempe, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
The disclosures made herein relate to RF power semiconductor devices. In accordance with one embodiment of the disclosures made herein, a RF power plastic semiconductor device comprises a semiconductor (RF) device, a Low Temperature Co-Fired Ceramic (LTCC) impedance matching structure electrically connected to the RF device and a plastic package body formed over the RF device and the impedance matching structure. The LTCC impedance matching structure comprises a metallized layer overlying a major body portion of the impedance matching structure and comprises a passivation layer on the metallized layer. The passivation layer enhances bond strength of a mold compound of the plastic package body to the metallized layer. Portions of the metallized layer are exposed through the passivation layer for enabling electrical interconnects to be formed between the LTCC impedance matching structure and the RF device. Preferably, RF power plastic packages in accordance with embodiments of the disclosures made herein exhibit terminal impedance of at least about twice that of conventional RF power plastic packages.