The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Sep. 19, 2003
Kendra Gallup, Marina Del Rey, CA (US);
Brenton A. Baugh, Palo Alto, CA (US);
Robert E. Wilson, Palo Alto, CA (US);
James A. Matthews, Milpitas, CA (US);
James H. Williams, Walnut Creek, CA (US);
Tak Kui Wang, Saratoga, CA (US);
Kendra Gallup, Marina Del Rey, CA (US);
Brenton A. Baugh, Palo Alto, CA (US);
Robert E. Wilson, Palo Alto, CA (US);
James A. Matthews, Milpitas, CA (US);
James H. Williams, Walnut Creek, CA (US);
Tak Kui Wang, Saratoga, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.