The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Oct. 02, 2002
Kiyoshi Adachi, Hiratsuka, JP;
Masanori Yagi, Kanagawa, JP;
Kiyoshi Adachi, Hiratsuka, JP;
Masanori Yagi, Kanagawa, JP;
Molex Incorporated, Lisle, IL (US);
Abstract
The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body () in which a mounting hole () is provided for each contact (), a through-hole pierced in a height direction of the socket body and a contact support hole () are provided. Each contact () is provided with an upright piece () extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion () formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection () is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.