The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Jul. 03, 2003
Albert M. Benzoni, South Pasadena, CA (US);
Henry A. Blauvelt, San Marino, CA (US);
David W. Vernooy, Sierra Madre, CA (US);
Joel S. Paslaski, Alhambra, CA (US);
Albert M. Benzoni, South Pasadena, CA (US);
Henry A. Blauvelt, San Marino, CA (US);
David W. Vernooy, Sierra Madre, CA (US);
Joel S. Paslaski, Alhambra, CA (US);
Xponent Photonics Inc, Monrovia, CA (US);
Abstract
A method for micro-hermetic packaging of an optical device comprises: forming a micro-hermetic cavity on a substrate; providing a transmission optical waveguide transferring optical power between the interior and the exterior of the micro-hermetic cavity; fabricating or mounting at least one optical device within the micro-hermetic cavity; enabling optical power transfer between the optical device and the transmission optical waveguide; and sealing the optical device within the micro-hermetic cavity. The micro-hermetic cavity may be fabricated of a size comparable to the optical device, and many such cavities may be simultaneously fabricated on a single substrate using wafer-scale processing. The transmission optical waveguide, electrical feed-throughs, and/or other monitoring/controlling components may be provided with the micro-hermetic cavity on the same substrate, or as a separate component and/or on a separate substrate. Alternatively, the optical device, transmission optical waveguide, and any other associated components may be embedded in transparent material for hermetic sealing.