The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 2006
Filed:
Oct. 22, 2002
Applicant:
Sul Kay Wong, North Point, HK;
Inventor:
Sul Kay Wong, North Point, HK;
Assignee:
Jetta Company Limited, Fanling, CN;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Method for producing a printed circuit board on a substrate comprising five steps: (a) printing a predetermined circuit pattern onto the substrate using a conductive material, (b) applying additional connection traces onto the substrate, (c) depositing a metal onto the printed circuit pattern by electroplating or electroforming a metal onto the substrate, (d) applying an adhesion and insulation glue layer over portions of the metal that comprises the desired circuit pattern, and (e) removing any undesired connection traces from the substrate.