The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2005

Filed:

Jun. 20, 2003
Applicants:

Kurt R. Carlson, Simi Valley, CA (US);

Kristin C. Cooley, Sherman Oaks, CA (US);

John P. Rahn, West Hills, CA (US);

Manfred Schiruska, Woodland Hills, CA (US);

Inventors:

Kurt R. Carlson, Simi Valley, CA (US);

Kristin C. Cooley, Sherman Oaks, CA (US);

John P. Rahn, West Hills, CA (US);

Manfred Schiruska, Woodland Hills, CA (US);

Assignee:

Northrop Grumman Corporation, Los Angeles, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B006/04 ;
U.S. Cl.
CPC ...
Abstract

In one example, the voidscomprise one or more gas (e.g., air) bubbles in the solid material. In another example, the voidscomprise a structure that preserves a space in the solid material. In a further example, the voidscomprise hollow elastomeric bubbles, for example, hollow elastomeric microspheres. The hollow elastomeric microspheres comprise microballoons with tin walls that encapsulate a gas to allow for easy compression. For example, the walls of the hollow elastomeric microspheres are strong enough to avoid breakage under pressure, but thin enough to easily compress. In a further example, once cured in the solid material, the hollow elastomeric microspheres comprise substantially similar compressibility characteristics as gas bubbles. The voidsin one example are added to a resin of the solid materialin a substantially uniform distribution. For example, the hollow elastomeric microspheres are stirred into the resin of the solid material


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