The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2005

Filed:

Feb. 26, 2003
Applicants:

Yasunori Miyazawa, Sendai, JP;

Katsuji Kaminishi, Sendai, JP;

Inventors:

Yasunori Miyazawa, Sendai, JP;

Katsuji Kaminishi, Sendai, JP;

Assignee:

Ryowa Electronics Co., Ltd., Miyagi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P003/08 ; H01P001/04 ;
U.S. Cl.
CPC ...
Abstract

A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.


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