The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
Jan. 21, 2004
Masayoshi Tonouchi, Suita, JP;
Kodo Kawase, Wako, JP;
Tomoya Hirosumi, Anjo, JP;
Ryoichi Fukusawa, Otawara, JP;
Masayoshi Tonouchi, Suita, JP;
Kodo Kawase, Wako, JP;
Tomoya Hirosumi, Anjo, JP;
Ryoichi Fukusawa, Otawara, JP;
Riken, Wako, JP;
Aisin Seiki Kabushiki Kaisha, Kariya, JP;
Abstract
An apparatus that inspects wire breaking of a semiconductor integrated circuit includes a voltage applying device (), a light pulse source (), a scanning device (), an electromagnetic wave detection device (), and a wire breaking detection device (). The voltage applying device () maintains a semiconductor integrated circuit in a state where a predetermined voltage is being applied thereto. The light pulse source () generates an ultrashort light pulse (). The scanning device () two-dimensionally scans and irradiates the two-dimensional circuit of the semiconductor integrated circuit by using the ultrashort light pulse (). The electromagnetic wave detection device () detects an electromagnetic wave () radiated from a position irradiated with the ultrashort light pulse on the semiconductor integrated circuit. The wire breaking detection device () detects wire breaking of the irradiated position based on presence and absence or intensity of the electromagnetic wave.