The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
May. 12, 2005
Rokuro Kambe, Nagoya, JP;
Tetsuya Kasiwagi, Aichi, JP;
Yukihiro Kimura, Nagoya, JP;
Yasuhiro Sugimoto, Konan, JP;
Kazuhiro Suzuki, Kasugai, JP;
Rokuro Kambe, Nagoya, JP;
Tetsuya Kasiwagi, Aichi, JP;
Yukihiro Kimura, Nagoya, JP;
Yasuhiro Sugimoto, Konan, JP;
Kazuhiro Suzuki, Kasugai, JP;
NGK Spark Plug, Ltd., Aichi, JP;
Abstract
An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.