The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2005
Filed:
Jul. 08, 2003
Frank S Geefay, Cupertino, CA (US);
Qing Gan, Fremont, CA (US);
Ann Mattos, San Jose, CA (US);
Domingo a Figueredo, Union City, CA (US);
Frank S Geefay, Cupertino, CA (US);
Qing Gan, Fremont, CA (US);
Ann Mattos, San Jose, CA (US);
Domingo A Figueredo, Union City, CA (US);
Agilent Technologies, Inc., Palo Alto, CA (US);
Abstract
A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of many substances that exhibit acceptable adhesion, sealing, and other properties that ensure a hermetically sealed environment. The gasket is carved out from the cap wafer material itself. The cap wafer is typically made of extremely strong and rigid material such as silicon. Since the gasket is made from the cap wafer, the gasket itself is also extremely strong and rigid.