The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 27, 2005

Filed:

Nov. 07, 2002
Applicants:

Keiichi Nakao, Hirakata, JP;

Satoshi Tomioka, Moriguchi, JP;

Hideyuki Okinaka, Toyonaka, JP;

Inventors:

Keiichi Nakao, Hirakata, JP;

Satoshi Tomioka, Moriguchi, JP;

Hideyuki Okinaka, Toyonaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B001/22 ;
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 μm or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.


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