The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Apr. 16, 2003
Young-woo Kim, Chungchungnam-do, KR;
Byoung-ho Rhee, Daejeon, KR;
Dek-gin Yang, Chungchungbuk-do, KR;
Young-sang Cho, Chungju-si, KR;
Kyu-hyok Yim, Chungchungbuk-do, KR;
Young-Woo Kim, Chungchungnam-do, KR;
Byoung-Ho Rhee, Daejeon, KR;
Dek-Gin Yang, Chungchungbuk-do, KR;
Young-Sang Cho, Chungju-si, KR;
Kyu-Hyok Yim, Chungchungbuk-do, KR;
Samsung Electro-Mechanics Co., Ltd., Kyunggi-Do, KR;
Abstract
The present invention discloses a multi-layer Printed Circuit Board (PCB) and method for coupling block type multichannel optical signals, the method including the steps of i) forming one or more first optical via holes to allow one or more first optical signal coupling blocks to be inserted therein, ii) aligning a first optical waveguide and the first optical signal coupling blocks so that the first optical waveguide is interconnected to the first optical signal coupling blocks via an optical signal, iii) attaching a first fixing guide to a base board to fasten the first optical signal coupling blocks, iv) removing the first fixing guide and forming one or more second optical via holes to allow one or more second optical signal coupling blocks to be inserted therein, and v) repeatedly performing steps i) to iv) as many times as a number of layers of the multi-layer PCB.