The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Apr. 15, 2004
Hideki Asao, Tokyo, JP;
Hiroshi Osakada, Tokyo, JP;
Hideyuki Oohashi, Tokyo, JP;
Kyouko Shinozaki, Tokyo, JP;
Kenji Tatano, Tokyo, JP;
Hideki Asao, Tokyo, JP;
Hiroshi Osakada, Tokyo, JP;
Hideyuki Oohashi, Tokyo, JP;
Kyouko Shinozaki, Tokyo, JP;
Kenji Tatano, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
High frequency packages have a plurality of apertures (notches) as antennas, and each of these apertures possesses a specific resonance frequency that may exist within the frequency bandwidth used in the high frequency packages in a high frequency band. Thus, the resonance frequency produced within the package is shifted outside the frequency bandwidth. A high frequency package is provided with a metal frame disposed on a metal bottom plate and having apertures for connecting with external terminals, dielectrics being disposed on the bottom metal plate, and on which a high frequency transmission line and a plurality of input and output terminals are formed, microwave circuitry being contained in the metal frame, and a metal lid, wherein the frequency of the aperture's resonance arising from electromagnetic field between the metal frame and the metal bottom plate, is shifted outside the frequency bandwidth by diminishing and optimizing the width of the aperture.