The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2005
Filed:
Jan. 12, 2005
Xiaodong Jin, Sunnyvale, CA (US);
Lawrence Tse, Fremont, CA (US);
King Chun Tsai, San Jose, CA (US);
George Chien, Cupertino, CA (US);
Shuran Wei, San Jose, CA (US);
Xiaodong Jin, Sunnyvale, CA (US);
Lawrence Tse, Fremont, CA (US);
King Chun Tsai, San Jose, CA (US);
George Chien, Cupertino, CA (US);
Shuran Wei, San Jose, CA (US);
Marvell International Ltd., Hamilton, BM;
Abstract
An input circuit for an integrated circuit (IC), which is mounted on a package having an input pin, rejects signal energy at a first frequency. A first bondwire arranged on the package has one end that communicates with the pin and an opposite end that communicates with components of the IC. A second bondwire located on the package has one end that communicates with the pin and an opposite end that communicates with a capacitance. The capacitance and an inductance of the first and second bondwires resonate at the first frequency to reject signal energy at the first frequency. Bondwires are also used to eliminate external components such as resonant components and impedance matching circuits to reduce cost.