The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2005

Filed:

Aug. 21, 2002
Applicant:

Kazuaki Ano, Hayami-gun, JP;

Inventor:

Kazuaki Ano, Hayami-gun, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ;
U.S. Cl.
CPC ...
Abstract

The objective of this invention is to provide a type of substrate for carrying a semiconductor chip that can increase the arrangement density of lands, and a type of semiconductor device that makes use of said substrate for carrying a semiconductor chip. Constitution: The conductor pattern on insulating substratecontains landsthat are respectively connected to electrode padsof semiconductor chipvia conductor wiresEach landof conductor patternas capillary tool contact portionwhere the capillary tool makes contact during bonding, and wire contact portionthat allows contact of conductor wireThe portion of wire contact portionon the side toward capillary tool contact portionbecomes constricted portionLandsare positioned such that constricted portionand capillary tool contact portionof adjacent landsare arranged facing each other.


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