The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2005

Filed:

Sep. 12, 2003
Applicants:

Hiroshi Shirai, Tokorozawa, JP;

Shinichi Hashimoto, Kawasaki, JP;

Hidenori Taguchi, Kawasaki, JP;

Inventors:

Hiroshi Shirai, Tokorozawa, JP;

Shinichi Hashimoto, Kawasaki, JP;

Hidenori Taguchi, Kawasaki, JP;

Assignee:

Tyco Electronics AMP K.K., Kanagawa-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R004/48 ;
U.S. Cl.
CPC ...
Abstract

A land grid array socket contact has a resilient contact that extends parallel to a base plate and is attached to at least one side walls of the base plate by a curved section angled approximatelydegrees from the at least one side wall. The resilient contact has a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board. In another embodiment, the land grid array socket contact has a resilient contact extending from an upper end of a base plate. The resilient contact has an elongated slit substantially in a center of the resilient contact with respect to a direction of width and a free end for contacting a contact pad. A board terminal extends from a lower end of the base plate for connection to a circuit board.


Find Patent Forward Citations

Loading…