The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Apr. 16, 2002
Applicants:
Helena Twardowska, Dublin, OH (US);
Laurence G. Dammann, Powell, OH (US);
Dennis H. Fisher, Westerville, OH (US);
Inventors:
Helena Twardowska, Dublin, OH (US);
Laurence G. Dammann, Powell, OH (US);
Dennis H. Fisher, Westerville, OH (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K011/04 ;
U.S. Cl.
CPC ...
Abstract
This invention relates to low-density thermosetting sheet molding compounds (SMC) including a treated inorganic clay, a curative, a low profile agent, a reinforcing agent, and preferably a low-density filler. The thermosetting SMC are used to prepare exterior and structural thermoset articles, e.g. auto parts, panels, etc.
Twardowska, Helena. (2005). Low-density thermosetting sheet molding compounds (U.S. Patent No. 6974848). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6974848
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile