The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2005
Filed:
Jun. 27, 2002
Junichi Iimura, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Yasuhiro Koike, Gunma, JP;
Hidefumi Saito, Gunma, JP;
Junichi Iimura, Gunma, JP;
Katsumi Okawa, Gunma, JP;
Yasuhiro Koike, Gunma, JP;
Hidefumi Saito, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.